Chemical - mechanical polish ( cmp ) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing . it is used during the fabrication process 化学-机械抛光( cmp ) -平整和抛光晶圆片的工艺,采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
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Chemical - mechanical polish ( cmp ) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing . it is used during the fabrication process 化学-机械抛光( cmp ) -平圆晶光抛和整片的工艺,采用化学移除和机械抛。式方种两光此工艺在前道工艺中使用。